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YAC Saw Damage Removal
Scratch marks made by the SI chips saw during wafer slicing can be remove by Saw Damage Removal process before Texturing.

 

Raw Wafer Before Process
After YAC Saw Damage Removal

Must have pre texture Process.
Special Etchant with high selecitvity for crystal orientaion is use.

YACJapan USA Address

46722 Fremont Blvd,
Fremont, CA

United States Of America
Phone: 1-510-623-0700
Fax: 1-510-623-0710
info@yacJapan.com